Laptop Cooling System: poor heatsink contact. Uneven mounting leaves part of a chip without effective thermal contact.

The distinguishing clue

Temperature rises almost immediately under modest load.

Checks before an assessment

Use the laptop on a firm surface with its vents unobstructed. Record whether exhaust airflow and fan noise change during normal work; stop after a thermal shutdown.

Stop point: Do not run heavy workloads when the fan is stopped or exhaust air is absent.

Workshop confirmation and repair

Device-level check: Record fan speed, temperature and workload, then inspect the complete air path and mounting.

Targeted check: Inspect screw order, contact pattern, pads and chassis deformation. If confirmed: Refit or replace the cooling assembly with even specified pressure.

Repair boundary: Repair the confirmed fan, heatsink, pad, compound or control fault as one cooling path.

Related cause to rule out

When load temperature is high even with good airflow and fan speed, also consider Laptop Cooling System: dried thermal compound before choosing a repair.

Checks after the work

After repair or replacement, check idle, processor load, fan response, sleep and cooldown.

For an AEPC repair assessment in East Auckland, provide the exact model and observed clue. Call 027 908 8880 before visiting the Burswood workshop.